Hybrid Laser Tech, a division of Shearline Precision Engineering, manufactures and supplies precision laser cut ceramic substrates to a range of industries including microelectronics and medical devices. It uses the most advanced CO2 laser systems to profile, cut and scribe ceramic substrates, metals and other specialised materials, each with their own unique mechanical, electrical, thermal and bio-chemical properties.
HLT also works with R&D departments within the private sector and academia, and applications are extremely varied. Recent projects have included cutting novel alloys, shaping crystals grown under lab conditions, and cutting diverse materials such as leather, graphite, sapphire, ruby, FR4, PZT, silicon and Nitinol (memory metal). Parts are diamond lapped and aqueous cleaned ready for surface coating to help adhesion of circuits.
- Laser cutting (11 machines) of ceramics, plastics, metals and composites
- Laser scribing
- Laser drilling (down to 75 microns), engraving, profiling, scanning (textures surface to improve adhesion)
- Expertise in high purity ceramic substrates
OGP Smartscope – Magnification x288 actual size. This is a video measuring machine that can also provide photographs of lasered features. The accuracy goes down 1000th of a micron. SPC measuring methods are used when requested. Standard AQL’s are always used to customer specification.